Contract notice
Section I: Contracting
authority
I.1) Name and addresses
Compound Semiconductor Applications Catapult Ltd
1 Caspian Point, Pierhead Street, Cardiff Bay
Cardiff
CF10 4DQ
UK
E-mail: procurement@csa.catapult.org.uk
NUTS: UKL
Internet address(es)
Main address: https://csa.catapult.org.uk
I.3) Communication
The procurement documents are available for unrestricted and full direct access, free of charge at:
https://csa.catapult.org.uk
Additional information can be obtained from the abovementioned address
Tenders or requests to participate must be sent electronically to:
https://csa.catapult.org.uk
Tenders or requests to participate must be sent to the abovementioned address
I.4) Type of the contracting authority
Other: Partially publically funded through another Contracting Authority
I.5) Main activity
Other: Research and development
Section II: Object
II.1) Scope of the procurement
II.1.1) Title
Die Bonder
Reference number: ITC-2019-027
II.1.2) Main CPV code
38000000
II.1.3) Type of contract
Supplies
II.1.4) Short description
The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build.
As part of the package assembly research and development methodology we require a machine to perform die bonding on to package, module and PCB boards.
The bonding equipment shall allow manual and semi-automatic bonding for experimentation and low volume prototype build. It shall be adaptable to bond a wide variety of components from chip level through to module level using organic-inorganics substrates, a variety of adhesives, and PCBs for all required package architectures required for Photonics, Power, and RF, e.g. standard industry package units; multi-chip modules and System-in-Package solutions.
II.1.5) Estimated total value
Value excluding VAT:
180 000.00
GBP
II.1.6) Information about lots
This contract is divided into lots:
No
II.2) Description
II.2.3) Place of performance
NUTS code:
UKL
II.2.4) Description of the procurement
The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build.
As part of the package assembly research and development methodology we require a machine to perform die bonding on to package, module and PCB boards.
The bonding equipment shall allow manual and semi-automatic bonding for experimentation and low volume prototype build. It shall be adaptable to bond a wide variety of components from chip level through to module level using organic-inorganics substrates, a variety of adhesives, and PCBs for all required package architectures required for Photonics, Power, and RF, e.g. standard industry package units; multi-chip modules and System-in-Package solutions.
The system will be in the CSA Catapults Innovation Centre, within the Advanced Packaging Laboratory, which will be equipped with access to all power and services for full installation and operation.
The Catapult may also purchase additional related services.
II.2.5) Award criteria
Price is not the only award criterion and all criteria are stated only in the procurement documents
II.2.6) Estimated value
Value excluding VAT:
180 000.00
GBP
II.2.7) Duration of the contract, framework agreement or dynamic purchasing system
Start:
24/05/2019
End:
23/05/2022
This contract is subject to renewal: No
II.2.9) Information about the limits on the number of candidates to be invited
II.2.10) Information about variants
Variants will be accepted:
No
II.2.11) Information about options
Options:
No
II.2.13) Information about European Union funds
The procurement is related to a project and/or programme financed by European Union funds:
No
II.2.14) Additional information
To express interest in this opportunity and receive the tender documents, please email procurement@csa.catapult.org.uk with reference ITC-2019-027 in the subject field.
Section IV: Procedure
IV.1) Description
IV.1.1) Type of procedure
Open procedure
IV.1.8) Information about Government Procurement Agreement (GPA)
The procurement is covered by the Government Procurement Agreement:
Yes
IV.2) Administrative information
IV.2.2) Time limit for receipt of tenders or requests to participate
Date:
07/05/2019
Local time: 12:00
IV.2.4) Languages in which tenders or requests to participate may be submitted
EN
IV.2.6) Minimum time frame during which the tenderer must maintain the tender
Duration in months: 3 (from the date stated for receipt of tender)
IV.2.7) Conditions for opening of tenders
Date:
07/05/2019
Local time: 12:00
Section VI: Complementary information
VI.1) Information about recurrence
This is a recurrent procurement:
No
VI.4) Procedures for review
VI.4.1) Review body
Compound Semiconductor Applications Catapult
Cardiff
UK
VI.5) Date of dispatch of this notice
05/04/2019