II.2.2) Additional CPV code(s)
38000000
33115100
33111000
II.2.3) Place of performance
NUTS code:
UKL
II.2.4) Description of the procurement
Scope
The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, photonics, and power compound semiconductor devices, modules and systems. The facility enables research, proof of concept and provides the capability to demonstrate the feasibility and undertake small volume prototype builds.
As part of the package assembly research and development methodology, we require advanced non-destructive metrology tools that support in-line process optimisation, product development and quality assurance of complex fine-pitch 3D packaging architectures. High-resolution X-ray equipment with CT scan capability is required the routine microelectronics assembly verification, optimisation of interconnect layers, finding buried defects and failure analysis for developing a reliable and quality integration process. The typical application involves X-ray imaging of wire bonds, die bonds, PCB and flip-chip assembly interconnects. The computerised tomography (CT) option integrated with X-ray system will be used for 3D imaging, 3D metrology of embedded structures, 3D model reconstruction, virtual micro sectioning and complete visualisation of the defects. Capability to have optional upgrades, such as heated sample holders are beneficial for advanced analysis of the interconnects.
The manufacturer/authorised vendor shall install the system at the Innovation Centre, CSA Catapult, within the advanced packaging laboratory, which will be equipped with access to all power and services for full installation and operation and be used to support contract research and development or commercial opportunities within the UK. The manufacturer/authorised vendor is also responsible for providing necessary training, warranty and service/maintenance support.
System outline
The system architecture is expected to be a standalone machine with a number of modules and tool options to allow the imaging and failure analysis of electronics micro assembly.
The system shall provide a user-controlled interface for the imaging of microelectronics devices and modules for RF, photonics and power packaging. The system should have the capability to be used for both prototype device and low volume production quantities. The system shall be easy to configure and change for the user to allow different processes.
A system solution is required that is flexible and upgradeable in the future. Additional module options can then be purchased based on changing industry trends or specific requirements from customers or partners for technology development. The system should also include user software, installation, and training.
Additional Information
The estimated budget range for the contract is GBP 300 000-GBP 400 000. The budget for the base system and additional tooling is expected to be a maximum of GBP 300 000, with the estimated maximum value covering related future services and options.
The Catapult may not be able to purchase the entire system at once, so it is requested that the quotation is itemised with base system price and optional items.
The manufacturer/authorised vendor shall install the system at the Innovation Centre, CSA Catapult, by March 2021.
II.2.5) Award criteria
Price is not the only award criterion and all criteria are stated only in the procurement documents
II.2.6) Estimated value
Value excluding VAT:
400 000.00
GBP
II.2.7) Duration of the contract, framework agreement or dynamic purchasing system
Duration in months: 48
This contract is subject to renewal: No
II.2.9) Information about the limits on the number of candidates to be invited
II.2.10) Information about variants
Variants will be accepted:
No
II.2.11) Information about options
Options:
No
II.2.13) Information about European Union funds
The procurement is related to a project and/or programme financed by European Union funds:
No
II.2.14) Additional information
To express interest in this opportunity and receive the procurement documents, please email procurement@csa.catapult.org.uk with the reference ICT-2020-041 in the subject field.