Contract notice
Section I: Contracting
authority
I.1) Name and addresses
Compound Semiconductor Applications Catapult
CSA Catapult Innovation Centre Celtic Way Imperial Park
Newport
NP10 8BE
UK
E-mail: procurement@csa.catapult.org.uk
NUTS: UKL
Internet address(es)
Main address: https://csa.catapult.org.uk
I.3) Communication
The procurement documents are available for unrestricted and full direct access, free of charge at:
http://csa.catapult.org.uk
Additional information can be obtained from the abovementioned address
Tenders or requests to participate must be sent electronically to:
https://csa.catapult.org.uk
Tenders or requests to participate must be sent to the abovementioned address
I.4) Type of the contracting authority
Other: Partially publically funded through another contracting authority
I.5) Main activity
Other: Research and development
Section II: Object
II.1) Scope of the procurement
II.1.1) Title
Thermal Imaging IR Camera System
Reference number: ITC-2020-042
II.1.2) Main CPV code
31720000
II.1.3) Type of contract
Supplies
II.1.4) Short description
The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and power compound semiconductor devices, modules and systems. The facility enables research, proof of concept and provides capability to demonstrate feasibility and undertake small volume prototype builds.
As a part of the package assembly research and development methodology, we require an IR thermal imaging system to validate compound semiconductor-based package/module/PCB thermal designs and potentially to test materials.
The manufacturer/authorised vendor shall install the system at the Innovation Centre, CSA Catapult, by March 2021.
II.1.5) Estimated total value
Value excluding VAT:
170 000.00
GBP
II.1.6) Information about lots
This contract is divided into lots:
No
II.2) Description
II.2.2) Additional CPV code(s)
38000000
II.2.3) Place of performance
NUTS code:
UKL
II.2.4) Description of the procurement
The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and power compound semiconductor devices, modules and systems. The facility enables research, proof of concept and provides capability to demonstrate feasibility and undertake small volume prototype builds.
As a part of the package assembly research and development methodology, we require an IR thermal imaging system to validate compound semiconductor-based package/module/PCB thermal designs and potentially to test materials.
This equipment shall be capable of capturing transient temperature profile of power devices and modules, ideally in the 10s of kHz regime (with window/sub window options), with high spatial optical resolution, ideally down to 5-10 m range, and high thermal sensitivity, with ~ ±2 % or 2 ºC precision (whichever is higher precision), covering up to 300 ºC. The system shall also allow flexibility to measure high optical resolution images as well as large field of views, for example in the 10s of mm range as well as 10s of cm range, with its optics options, including lens mounting accessories (tubes, mounts, interchangeable rigs and so forth), with an acquisition time less than 1s. The mounting optics and camera aperture shall match such that vignetting be avoided. This system will be used mostly for power electronics packages, and will be useful for RF and photonics packages, as well. Flexibility of the system for various lens mounting and frequency modulation options (for the detector) will be required. The camera focus shall be easy. If the detector is cooled by active means, a vibration isolator should be needed, depending on the distortion in the thermal image, to minimise vibration due to the cooling unit. An additional sample translation stage (x-y) with a position sensitivity lower than the best achievable optical resolution of the system shall be required for accurate thermal images and possible future upgrades of the system. Maximum weight the stage can withstand shall be adequate for thermal imaging of electronic systems. The system shall provide a thermal image analysis software and provide options for software development kits (SDK), for example compatible with LabVIEW, MATLAB and so forth, for extended application ranges.
The manufacturer/authorised vendor shall install the system at the Innovation Centre, CSA Catapult, within the advanced packaging laboratory, which will be equipped with access to all power and services for full installation and operation and be used to support contract research and development or commercial opportunities within the UK. The manufacturer/authorised vendor is also responsible for providing necessary training, warranty and service/maintenance support.
The manufacturer/authorised vendor shall install the system at the Innovation Centre, CSA Catapult, by March 2021.
II.2.5) Award criteria
Price is not the only award criterion and all criteria are stated only in the procurement documents
II.2.6) Estimated value
Value excluding VAT:
170 000.00
GBP
II.2.7) Duration of the contract, framework agreement or dynamic purchasing system
Duration in months: 48
This contract is subject to renewal: No
II.2.9) Information about the limits on the number of candidates to be invited
II.2.10) Information about variants
Variants will be accepted:
No
II.2.11) Information about options
Options:
No
II.2.13) Information about European Union funds
The procurement is related to a project and/or programme financed by European Union funds:
No
II.2.14) Additional information
To express interest in this opportunity and receive the procurement documents, please email procurement@csa.catapult.org.uk with the reference ICT-2020-042 in the subject field.
Section IV: Procedure
IV.1) Description
IV.1.1) Type of procedure
Open procedure
- Accelerated procedure
Justification:
It is likely that the value of the contract will be under the threshold for advertisement in the OJEU, however in line with our policy and best practice, we are advertising in OJEU in addition. A shorter timescale is required due the the lead time of the potential goods to meet the requirements. A longer response period is not practical on this occasion.
IV.1.8) Information about Government Procurement Agreement (GPA)
The procurement is covered by the Government Procurement Agreement:
Yes
IV.2) Administrative information
IV.2.2) Time limit for receipt of tenders or requests to participate
Date:
27/11/2020
Local time: 12:00
IV.2.4) Languages in which tenders or requests to participate may be submitted
EN
IV.2.6) Minimum time frame during which the tenderer must maintain the tender
Duration in months: 6 (from the date stated for receipt of tender)
IV.2.7) Conditions for opening of tenders
Date:
27/11/2020
Local time: 12:00
Section VI: Complementary information
VI.1) Information about recurrence
This is a recurrent procurement:
No
VI.4) Procedures for review
VI.4.1) Review body
Compound Semiconductor Applications Catapult
Newport
UK
VI.5) Date of dispatch of this notice
12/11/2020