Contract award notice
Results of the procurement procedure
Section I: Contracting
entity
I.1) Name and addresses
Compound Semiconductor Applications Catapult Ltd
1 Caspian Point, Pierhead Street, Cardiff Bay
Cardiff
CF10 4DQ
UK
E-mail: procurement@csa.catapult.org.uk
NUTS: UKL
Internet address(es)
Main address: https://csa.catapult.org.uk
I.4) Type of the contracting authority
Other: Partially publically funded through another contracting authority
I.5) Main activity
Other: Research and development
Section II: Object
II.1) Scope of the procurement
II.1.1) Title
Die Bonder
Reference number: ITC-2019-027
II.1.2) Main CPV code
38000000
II.1.3) Type of contract
Supplies
II.1.4) Short description
The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, photonics, and power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build.
As part of the package assembly research and development methodology we require a machine to perform die bonding on to package, module and PCB boards.
The bonding equipment shall allow manual and semi-automatic bonding for experimentation and low volume prototype build. It shall be adaptable to bond a wide variety of components from chip level through to module level using organic-inorganics substrates, a variety of adhesives, and PCBs for all required package architectures required for photonics, power, and RF, e.g. standard industry package units; multi-chip modules and system-in-package solutions.
II.1.6) Information about lots
This contract is divided into lots:
No
II.1.7) Total value of the procurement
Value excluding VAT:
146 000.00
GBP
II.2) Description
II.2.3) Place of performance
NUTS code:
UKL
II.2.4) Description of the procurement
The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build.
As part of the package assembly research and development methodology we require a machine to perform die bonding on to package, module and PCB boards.
The bonding equipment shall allow manual and semi-automatic bonding for experimentation and low volume prototype build. It shall be adaptable to bond a wide variety of components from chip level through to module level using organic-inorganics substrates, a variety of adhesives, and PCBs for all required package architectures required for photonics, power, and RF, e.g. standard industry package units; multi-chip modules and system-in-package solutions.
The system will be in the CSA Catapults Innovation Centre, within the advanced packaging laboratory, which will be equipped with access to all power and services for full installation and operation.
The Catapult may also purchase additional related services.
II.2.5) Award criteria
Quality criterion: Technical
/ Weighting: 60
Price
/ Weighting:
40
II.2.11) Information about options
Options:
No
II.2.13) Information about European Union funds
The procurement is related to a project and/or programme financed by European Union funds:
No
II.2.14) Additional information
To express interest in this opportunity and receive the tender documents, please email procurement@csa.catapult.org.uk with reference ITC-2019-027 in the subject field.
Section IV: Procedure
IV.1) Description
IV.1.1) Type of procedure
Open procedure
IV.1.8) Information about Government Procurement Agreement (GPA)
The procurement is covered by the Government Procurement Agreement:
Yes
IV.2) Administrative information
IV.2.1) Previous publication concerning this procedure
Notice number in the OJ S:
2019/S 070-164615
Section V: Award of contract
Title: Die Bonder
A contract/lot is awarded:
Yes
V.2 Award of contract
V.2.1) Date of conclusion of the contract
19/06/2019
V.2.2) Information about tenders
Number of tenders received: 2
The contract has been awarded to a group of economic operators:
No
V.2.3) Name and address of the contractor
INSETO (UK) Ltd
Unit 25 Focus 303 Business Centre Focus Way
Andover
SP10 5NY
UK
NUTS: UK
The contractor is an SME:
Yes
V.2.4) Information on value of the contract/lot (excluding VAT)
Initial estimated total value of the contract/lot:
Total value of the contract/lot:
: 146 000.00
GBP
V.2.5) Information about subcontracting
Section VI: Complementary information
VI.4) Procedures for review
VI.4.1) Review body
Compound Semiconductor Applications Catapult
Cardiff
UK
VI.5) Date of dispatch of this notice
14/10/2019