Contract award notice
Results of the procurement procedure
Section I: Contracting
entity
I.1) Name and addresses
Cardiff University
Procurement Services, McKenzie House, 30-36 Newport Road
Cardiff
CF24 0DE
UK
Telephone: +44 2920879648
E-mail: halea3@cardiff.ac.uk
NUTS: UKL
Internet address(es)
Main address: http://www.cardiff.ac.uk/business/why-work-with-us/for-suppliers
Address of the buyer profile: https://www.sell2wales.gov.wales/search/Search_AuthProfile.aspx?ID=AA0258
I.2) Joint procurement
The contract is awarded by a central purchasing body
I.4) Type of the contracting authority
Body governed by public law
I.5) Main activity
Education
Section II: Object
II.1) Scope of the procurement
II.1.1) Title
Deposition Tools
Reference number: CU.772.TH
II.1.2) Main CPV code
38000000
II.1.3) Type of contract
Supplies
II.1.4) Short description
- An ICP Plasma Etch system, with load lock, for etching III-V materials to shallow or standard (<10um) etch depths, and be capable of etching the following materials GaAs, GaN, InP, InSb/GaSb, SixNy, BCB and Polyimide
- A High Density Plasma Etch system designed to etch strongly bonded materials, with load lock, capable of etching strongly bonded materials including SiO2 (>100um), Glass, SiNx,, SiC, GaN, PZT and AlN and Al2O3. Must operate with higher plasma density and at lower pressures than conventional ICP systems.
II.1.6) Information about lots
This contract is divided into lots:
No
II.1.7) Total value of the procurement
Value excluding VAT:
1 666 666.00
GBP
II.2) Description
II.2.3) Place of performance
NUTS code:
UKL22
II.2.4) Description of the procurement
The requirement of the Plasma ETCH tools is to etch III-V semiconductor samples, wafers and other substrates, ranging in size from 10 x 10 mm up to 200mm diameter wafers.
The requirement of the PECVD tool is to deposit films of dielectric materials onto semiconductor samples, wafers and other substrates, ranging in size from 10 x 10 mm up to 200mm diameter wafers.
The supplier must provide all 3 systems, to criteria set out below, for the bid to be successful.
Specification of Equipment
An ICP Plasma Etch system, with load lock, for etching III-V materials to shallow or standard (<10um) etch depths, and be capable of etching the following materials GaAs, GaN, InP, InSb/GaSb, SixNy, BCB and Polyimide
A High Density Plasma Etch system designed to etch strongly bonded materials, with load lock, capable of etching strongly bonded materials including SiO2 (>100um), Glass, SiNx,, SiC, GaN, PZT and AlN and Al2O3. Must operate with higher plasma density and at lower pressures than conventional ICP systems.
II.2.5) Award criteria
Quality criterion: Quality
/ Weighting: 70
Price
/ Weighting:
30
II.2.11) Information about options
Options:
No
II.2.13) Information about European Union funds
The procurement is related to a project and/or programme financed by European Union funds:
Yes
Section IV: Procedure
IV.1) Description
IV.1.1) Type of procedure
Open procedure
IV.1.8) Information about Government Procurement Agreement (GPA)
The procurement is covered by the Government Procurement Agreement:
Yes
IV.2) Administrative information
IV.2.1) Previous publication concerning this procedure
Notice number in the OJ S:
2022/S 016-039581
Section V: Award of contract
A contract/lot is awarded:
Yes
V.2 Award of contract
V.2.1) Date of conclusion of the contract
24/03/2022
V.2.2) Information about tenders
Number of tenders received: 1
Number of tenders received from SMEs: 0
Number of tenders received from tenderers from EU Member States: 0
Number of tenders received from tenderers from non-EU Member States: 0
Number of tenders received by electronic means: 1
The contract has been awarded to a group of economic operators:
No
V.2.3) Name and address of the contractor
SPTS Technologies Ltd
Coed Rhedyn, Ringland Way
Newport
NP182TA
UK
Telephone: +31 640212696
NUTS: UK
The contractor is an SME:
No
V.2.4) Information on value of the contract/lot (excluding VAT)
Total value of the contract/lot:
: 1 666 666.00
GBP
V.2.5) Information about subcontracting
Section VI: Complementary information
VI.3) Additional information
(WA Ref:119922)
VI.4) Procedures for review
VI.4.1) Review body
High Court
Royal Courts of Justice, The Strand
London
WC2A 2LL
UK
Telephone: +44 2079477501
VI.5) Date of dispatch of this notice
24/03/2022