Contract award notice
Results of the procurement procedure
Section I: Contracting
entity
I.1) Name and addresses
Swansea University
Procurement - VC's Office, Swansea University, Singleton Park
Swansea
SA2 8PP
UK
Contact person: James Thomas
Telephone: +44 1792602779
E-mail: procurement@swansea.ac.uk
NUTS: UKL18
Internet address(es)
Main address: www.swansea.ac.uk
Address of the buyer profile: https://www.sell2wales.gov.wales/search/Search_AuthProfile.aspx?ID=AA0345
I.2) Joint procurement
The contract is awarded by a central purchasing body
I.4) Type of the contracting authority
Body governed by public law
I.5) Main activity
Education
Section II: Object
II.1) Scope of the procurement
II.1.1) Title
Supply of Semiconductor Dicing and Grinding Systems
Reference number: SU154(21)
II.1.2) Main CPV code
38000000
II.1.3) Type of contract
Supplies
II.1.4) Short description
This Tender Specification is for the supply and installation of a Wafer Dicing System and a Wafer Grinding System. These systems will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility.
This requirement is split into two separate lots
II.1.6) Information about lots
This contract is divided into lots:
Yes
II.1.7) Total value of the procurement
Value excluding VAT:
385 000.00
GBP
II.2) Description
Lot No: 1
II.2.1) Title
Wafer Dicing System
II.2.2) Additional CPV code(s)
38000000
II.2.3) Place of performance
NUTS code:
UKL18
UKL17
UKL21
Main site or place of performance:
to be delivered to Swansea University Bay Campus or Newport Wafer Fab (to be determined prior to delivery)
II.2.4) Description of the procurement
This Tender Specification is for the supply and installation of a Wafer Dicing System and a Wafer Grinding System. These systems will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility.
II.2.5) Award criteria
Quality criterion: Technical
/ Weighting: 70
Price
/ Weighting:
30
II.2.11) Information about options
Options:
No
II.2.13) Information about European Union funds
The procurement is related to a project and/or programme financed by European Union funds:
No
II.2.14) Additional information
Funding for this procurement has been secured from the Driving the Electric Revolution (DER) Industrialisation Centres Programme via Innovate UK.
Lot No: 2
II.2.1) Title
Wafer Grinding System
II.2.2) Additional CPV code(s)
38000000
II.2.3) Place of performance
NUTS code:
UKL21
Main site or place of performance:
Newport Wafer Fab
II.2.4) Description of the procurement
This procurement is for the supply and installation of a Wafer Grinding System. This will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility.
II.2.5) Award criteria
Quality criterion: Technical
/ Weighting: 70
Price
/ Weighting:
30
II.2.11) Information about options
Options:
No
II.2.13) Information about European Union funds
The procurement is related to a project and/or programme financed by European Union funds:
No
II.2.14) Additional information
Funding for this procurement has been secured from the Driving the Electric Revolution (DER) Industrialisation Centres Programme via Innovate UK.
Section IV: Procedure
IV.1) Description
IV.1.1) Type of procedure
Open procedure
IV.1.8) Information about Government Procurement Agreement (GPA)
The procurement is covered by the Government Procurement Agreement:
Yes
IV.2) Administrative information
IV.2.1) Previous publication concerning this procedure
Notice number in the OJ S:
2021/S 000-017441
Section V: Award of contract
Lot No: 1
Title: Wafer Dicing System
A contract/lot is awarded:
Yes
V.2 Award of contract
V.2.1) Date of conclusion of the contract
19/10/2021
V.2.2) Information about tenders
Number of tenders received: 2
Number of tenders received from SMEs: 0
Number of tenders received from tenderers from EU Member States: 2
Number of tenders received from tenderers from non-EU Member States: 0
Number of tenders received by electronic means: 2
The contract has been awarded to a group of economic operators:
No
V.2.3) Name and address of the contractor
Disco HI-TEC UK LTD
Unit 34, Basepoint Business & Innovation Centre, Metcalf Way
Crawley
RH117XX
UK
Telephone: +44 4989909030
NUTS: UKJ2
The contractor is an SME:
No
V.2.4) Information on value of the contract/lot (excluding VAT)
Initial estimated total value of the contract/lot:
Total value of the contract/lot:
: 103 982.00
GBP
V.2.5) Information about subcontracting
Section V: Award of contract
Lot No: 2
Title: Wafer Grinding System
A contract/lot is awarded:
Yes
V.2 Award of contract
V.2.1) Date of conclusion of the contract
19/10/2021
V.2.2) Information about tenders
Number of tenders received: 1
Number of tenders received from SMEs: 0
Number of tenders received from tenderers from EU Member States: 1
Number of tenders received from tenderers from non-EU Member States: 0
Number of tenders received by electronic means: 1
The contract has been awarded to a group of economic operators:
No
V.2.3) Name and address of the contractor
Disco HI-TEC UK LTD
Unit 34, Basepoint Business & Innovation Centre, Metcalf Way
Crawley
RH117XX
UK
Telephone: +44 4989909030
NUTS: UKJ2
The contractor is an SME:
No
V.2.4) Information on value of the contract/lot (excluding VAT)
Initial estimated total value of the contract/lot:
Total value of the contract/lot:
: 278 592.00
GBP
V.2.5) Information about subcontracting
Section VI: Complementary information
VI.3) Additional information
(WA Ref:115452)
VI.4) Procedures for review
VI.4.1) Review body
High Court
Royal Courts of Justice, The Strand
London
WC2A 2LL
UK
Telephone: +44 2079477501
VI.5) Date of dispatch of this notice
08/11/2021