Contract notice
Section I: Contracting
authority
I.1) Name and addresses
Cardiff University
Procurement Services, McKenzie House, 30-36 Newport Road
Cardiff
CF24 0DE
UK
Telephone: +44 2920879648
E-mail: halea3@cardiff.ac.uk
NUTS: UKL
Internet address(es)
Main address: http://www.cardiff.ac.uk/business/why-work-with-us/for-suppliers
Address of the buyer profile: https://www.sell2wales.gov.wales/search/Search_AuthProfile.aspx?ID=AA0258
I.2) Joint procurement
The contract is awarded by a central purchasing body
I.3) Communication
The procurement documents are available for unrestricted and full direct access, free of charge at:
https://in-tendhost.co.uk/cardiffuniversity/aspx/Home
Additional information can be obtained from the abovementioned address
Tenders or requests to participate must be sent electronically to:
https://in-tendhost.co.uk/cardiffuniversity/aspx/Home
Electronic communication requires the use of tools and devices that are not generally available. Unrestricted and full direct access to these tools and devices is possible, free of charge, at:
https://in-tendhost.co.uk/cardiffuniversity/aspx/Home
I.4) Type of the contracting authority
Body governed by public law
I.5) Main activity
Education
Section II: Object
II.1) Scope of the procurement
II.1.1) Title
Deposition Tools
Reference number: CU.772.TH
II.1.2) Main CPV code
38000000
II.1.3) Type of contract
Supplies
II.1.4) Short description
- An ICP Plasma Etch system, with load lock, for etching III-V materials to shallow or standard (<10um) etch depths, and be capable of etching the following materials GaAs, GaN, InP, InSb/GaSb, SixNy, BCB and Polyimide
- A High Density Plasma Etch system designed to etch strongly bonded materials, with load lock, capable of etching strongly bonded materials including SiO2 (>100um), Glass, SiNx,, SiC, GaN, PZT and AlN and Al2O3. Must operate with higher plasma density and at lower pressures than conventional ICP systems.
II.1.5) Estimated total value
Value excluding VAT:
2 000 000.00
GBP
II.1.6) Information about lots
This contract is divided into lots:
No
II.2) Description
II.2.3) Place of performance
NUTS code:
UKL22
II.2.4) Description of the procurement
The requirement of the Plasma ETCH tools is to etch III-V semiconductor samples, wafers and other substrates, ranging in size from 10 x 10 mm up to 200mm diameter wafers.
The requirement of the PECVD tool is to deposit films of dielectric materials onto semiconductor samples, wafers and other substrates, ranging in size from 10 x 10 mm up to 200mm diameter wafers.
The supplier must provide all 3 systems, to criteria set out below, for the bid to be successful.
Specification of Equipment
An ICP Plasma Etch system, with load lock, for etching III-V materials to shallow or standard (<10um) etch depths, and be capable of etching the following materials GaAs, GaN, InP, InSb/GaSb, SixNy, BCB and Polyimide
A High Density Plasma Etch system designed to etch strongly bonded materials, with load lock, capable of etching strongly bonded materials including SiO2 (>100um), Glass, SiNx,, SiC, GaN, PZT and AlN and Al2O3. Must operate with higher plasma density and at lower pressures than conventional ICP systems.
II.2.5) Award criteria
Criteria below:
Quality criterion: Quality
/ Weighting: 70
Price
/ Weighting:
30
II.2.7) Duration of the contract, framework agreement or dynamic purchasing system
Duration in months: 6
This contract is subject to renewal: No
II.2.9) Information about the limits on the number of candidates to be invited
II.2.10) Information about variants
Variants will be accepted:
No
II.2.11) Information about options
Options:
No
II.2.13) Information about European Union funds
The procurement is related to a project and/or programme financed by European Union funds:
Yes
Section III: Legal, economic, financial and technical information
III.1) Conditions for participation
III.1.2) Economic and financial standing
Selection criteria as stated in the procurement documents
III.1.3) Technical and professional ability
Selection criteria as stated in the procurement documents
III.2) Conditions related to the contract
Section IV: Procedure
IV.1) Description
IV.1.1) Type of procedure
Open procedure
IV.1.8) Information about Government Procurement Agreement (GPA)
The procurement is covered by the Government Procurement Agreement:
Yes
IV.2) Administrative information
IV.2.2) Time limit for receipt of tenders or requests to participate
Date:
18/02/2022
Local time: 12:00
IV.2.4) Languages in which tenders or requests to participate may be submitted
EN
CY
IV.2.6) Minimum time frame during which the tenderer must maintain the tender
Duration in months: 3 (from the date stated for receipt of tender)
IV.2.7) Conditions for opening of tenders
Date:
18/02/2022
Local time: 12:00
Section VI: Complementary information
VI.1) Information about recurrence
This is a recurrent procurement:
No
VI.2) Information about electronic workflows
Electronic ordering will be used
Electronic invoicing will be accepted
Electronic payment will be used
VI.3) Additional information
(WA Ref:117762)
VI.4) Procedures for review
VI.4.1) Review body
High Court
Royal Courts of Justice, The Strand
London
WC2A 2LL
UK
Telephone: +44 2079477501
VI.5) Date of dispatch of this notice
19/01/2022